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• Shacham-Diamand, Y. - Advanced nanoscale ULSI interconnects: fundamentals and applications.

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Contenido

This book presents one of the new frontiers of modern electrochemistry science and technology: electrochemical processes for Ultra-large-Scale Integration (ULSI) technology for Integrated Circuits (ICs) applications. This is a field which influences our day to day life and still presents major technological and scientific challenges. This book reviews ULSI technology in light of all the novel electrochemical processes which make ULSI technology possible. The book will focus on sub-100 nm CMOS technology, mainly on copper-based metallization. The multidisciplinarity of this book makes it an especially valuabe tool for those interested in ULSI Interconnects

   INDICE: Introduction.- Technology Background.- Interconnect Materials.- Deposition Processes for ULSI Interconnects.- Modeling.- Electrochemical Process Integration.- Electrochemical Processes and Tools.- Metrology.- Summary and Foresight.

Interés para ...

Electrochemistry; Industrial Chemistry/Chemical Engineering. Process engineers in the microelectronics industry; design companies working with Cu technology; equipment manufacturers packaging industry; universities and research institutes with programs in ULSI design, microelectronics, MEMS and nanoelectronics; people in the electrochemical industry

Detalles del artículo

• Páginas : 365
• Editorial : Springer
• Idioma : Inglés
• Fecha de Publicación : 01/09/2009
• ISBN: 9780387958675
• Encuadernación : Cartoné
• Nº Volúmenes : 1
• País de Publicación : Estados Unidos
• Lugar de Publicación : New York